| Wafer |
A paper-thin slice cut from a cylindrical crystal
of pure semiconductor. |
| a |
| Wafer Probing |
The process of testing individual integrated
circuits while they still form part of a wafer. An automated tester
places probes on the device's pads, applies power to the power pads,
injects a series of signals into the input pads, and monitors the
corresponding signals returned from the output
pads. |
| a |
| Waveguide |
A transparent path bounded by
non-transparent, reflective areas, which is fabricated directly onto the
surface of a substrate. Used in the optical interconnection strategy
known as guided-wave. |
| a |
| Wave Soldering |
A process used to solder circuit boards populated
with through-hole components. A wave generating mechanism maintains a
wave( ) of hot, liquid solder traveling back and forth across the
surface of a tank. The populated circuit boards are passed over the wave
soldering machine on a conveyer belt. The velocity of the conveyer belt
is carefully controlled and synchronized such that the solder wave
brushes across the bottom of the board only once.
|
| a |
| Wire Bonding |
The process of connecting the pads on an
unpackaged integrated circuit to corresponding pads on a substrate using
wires that are finer than a human hair. Wire bonding may also be used to
connect the pads on an unpackaged integrated circuit, hybrid, or
multichip module to the leads of the component
package. |
|
| Wiring Layer |
A layer carrying wires in a discrete wired board.
See also signal layer. |
| a |
| Word |
